Rohde & Schwarz is offering a bond-free scholarship, the closing date of the application is 15th January 2017.

Interviews are planned for in Singapore currently – if there are exceptional candidates based in Germany, the HR representatives will get in touch and arrange something.

This Scholarship is set to repeat the next few years, so if you have friends who are interested, feel free to share it with them.

Further details can be found in the pdf at the link below: